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congatec expands its highly skilled engineering team, establishing congatec Asia Embedded Design subsidiary
congatec – the leading vendor of embedded and edge computing technology – today announced the establishment of its new subsidiary in Penang, Malaysia, marking a strategic expansion of its engineering and research footprint in Asia. The move signals congatec’s commitment to anchoring high-value embedded computing design, customisation and technical support capabilities in Malaysia as part of its global “local for local” strategy. As part of the expansion, congatec has onboarded an experienced embedded engineering team from Kontron Asia, comprising 23 specialised engineers, with plans to scale the Penang operation to approximately 70 employees over the medium term. The new subsidiary strengthens congatec’s regional research and development (R&D) and technical support…
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congatec launcht COM Express Compact Modul auf Basis der neuesten AMD Ryzen™ AI Embedded P100 Prozessorserie
congatec – der führende Anbieter von Embedded- und Edge-Computing-Technologie – gibt den Launch einer neuen COM Express 3.1 Type 6 Compact Modulserie bekannt. Die neuen conga-TCRP1 basieren auf den neuesten AMD Ryzen™ AI Embedded P100 Series Prozessoren mit 4 oder 6 Kernen und sind für den Industriellen Temperaturbereich von -40 °C bis +85° C erhältlich sind. Die neuen Module sind entwickelt als effizienter Einstieg in industrielle Edge-KI-Applikationen für Branchen wie Transportation, Medical, Smart-City-Infrastruktur, Gaming, Point-of-Sales, Robotik oder industrielle Automation. Embedded Computing Applikationen beschleunigen sie mit sie bis zu 59 TOPs kombinierter KI-Inferenz-Performance. Davon entfallen bis zu 50 TOPS auf die XDNA2 NPU, den Rest steuern bis zu 6 AMD Zen5…
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congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series
congatec – the leading provider of embedded and edge computing technology – today launched a new COM Express 3.1 Type 6 Compact module series. The new conga-TCRP1 modules are based on the latest AMD Ryzen™ AI Embedded P100 Series processors with 4 or 6 cores and support the industrial temperature range from -40 to +85 °C. The new modules are designed to provide an efficient entry into industrial edge AI applications across markets including transportation, medical, smart city infrastructure, gaming, point-of-sale, robotics, and industrial automation. They accelerate embedded computing applications with up to 59 TOPS of combined AI inference performance, with up to 50 TOPS provided by the XDNA2 NPU, and…
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congatec expands its Computer-on-Module portfolio with 18 new product families
congatec – a leading vendor of embedded and edge computing technology – is expanding its Computer-on-Module portfolio with 18 new JUMPtec product families. The move follows the acquisition of Kontron’s module business in July 2025. As a result, customers now have access to the world’s most comprehensive range of application-ready COM-HPC, COM Express, SMARC, and Qseven modules – engineered to the renowned “Designed in Germany” quality standard. As part of the integration, congatec is incorporating the new product families into its aReady.COM portfolio of application-ready hardware and software building blocks. This enables developers to integrate modules much more easily into their applications, improving time-to-market, reliability, and design confidence. Existing JUMPtec…
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congatec Computer-on-Modules fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards
congatec – a leading vendor of embedded and edge building blocks – today launched the industry’s broadest portfolio of Computer-on-Modules (COMs) based on Intel Core Ultra Series 3 processors . The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI acceleration. In most scenarios, the modules‘ high level of processing capability means discrete accelerator cards will not be necessary for embedded AI applications. The new Intel Core Ultra Series 3 processor-based COMs are ideal for deployment in AI-powered market segments spanning industrial automation and robotics, smart city and transportation, and healthcare and retail point-of-sale. congatec industry-leading edge AI COMs Five new congatec COMs across…
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Kontron and congatec unite to deliver secure embedded solutions
congatec – a leading vendor of embedded and edge computing technology – and Kontron – a leading global provider of IoT/Embedded Computer Technology (ECT) – today announced new modular and secure embedded platforms. At the core of this collaboration is the integration of KontronOS, Kontron’s secure, Linux®-based operating system, with congatec’s application-ready aReady.COM hardware and software building blocks. This integrated approach is designed to simplify and accelerate the development of security and application solutions that comply with IEC 62443. Thanks to the partnership with Kontron, KontronOS is now available as part of the aReady.COM portfolio. This allows customers to receive application-ready modules with a pre-installed and licensed operating system. The…
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Kontron und congatec bündeln ihre Kräfte für sichere Embedded-Lösungen
congatec – ein führender Anbieter von Embedded und Edge Computer Technologie – präsentiert gemeinsam mit Kontron – einem weltweit führenden Anbieter von Embedded- und IoT-Lösungen – neue, modulare und sichere Embedded-Plattformen. Im Mittelpunkt steht dabei die Kombination von KontronOS, dem sicheren Linux®-basierten Betriebssystem von Kontron, und den applikationsfertigen aReady.COM Hardware- und Software Building-Blocks von congatec. Dieser Ansatz soll das Ziel verfolgen, die Entwicklung von IEC-62443-konformen Sicherheits- und Applikationslösungen zu erleichtern und zu beschleunigen. Die Partnerschaft mit Kontron ermöglicht die Integration von KontronOS in das aReady.COM-Portfolio, wodurch Kunden applikationsfertige Module inklusive vorinstalliertem und lizenziertem Betriebssystem erhalten. congatecs Hypervisor-Technologie gemeinsam mit KontronOS und KontronAIShield trennt sicherheitskritische Kernanwendungen von IoT-Komponenten und gewährleistet maximale…
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congatec takes embedded ARM modules to a new level of performance
congatec – a leading vendor of embedded and edge computing technology – launched its first COM-HPC Mini Computer-on-Module (COM) powered by the Qualcomm Dragonwing™ IQ-X Series processors. The new conga-HPC/mIQ-X with the Qualcomm® Oryon™ CPU delivers exceptional single and multithread compute performance – previously achieved only with x86 based-designs – at best-in-class power efficiency. Edge AI applications, including local machine learning (ML), and the running of large language models (LLMs), benefit from up to 45 TOPS of AI performance with the dedicated NPU powered by the Qualcomm ® Hexagon™ processor. The conga-HPC/mIQ-X addresses the growing demand for high-performance, energy-efficient compute platforms in markets such as security, transactional retail, robotics, medical…
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congatec hebt embedded Arm-Module auf neues Performance-Level
congatec – ein führender Anbieter von Embedded- und Edge-Computing-Technologie – launcht sein erstes COM-HPC Mini Computer-on-Module (COM) mit Qualcomm Dragonwing™ IQ-X Prozessoren. Das neue conga-HPC/mIQ-X mit der Qualcomm® Oryon™ CPU bietet bei herausragender Energieeffizienz eine Single- und Multithread-Performance, die bisher nur x86-Designs erreichten. Edge-KI-Applikationen, wie lokales Machine Learning (ML) und die Ausführung von Large Language Models (LLMs) profitieren von der bis zu 45 TOPS starken KI-Rechenleistung der dediziertem Qualcomm® Hexagon™ NPU. Das conga-HPC/mIQ-X adressiert den steigenden Bedarf nach energieeffizienten High-Performance-Compute-Plattformen in Märkten wie Security, Transactional Retail, Robotik, Medizintechnik und industrielle Automation. Robust, kompakt und KI-optimiert Auf einem etwa kreditkartengroßen Formfaktor zeichnet es sich durch ein robustes Design mit gelötetem, schnellem…
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congatec simplifie la consolidation système en intégrant Hypervisor sur ses Computer-on-Modules x86
congatec – l’un des principaux fournisseurs de technologies embarquées et edge computing – intègre désormais Hypervisor dans tous ses nouveaux COM x86. Hypervisor de la société a été facilement ajouté aux Computer-on-Modules (COM) basés sur x86 de congatec. Désormais, Hypervisor sera intégré dans le micrologiciel et sera en standard sur tous les COM congatec x86, diminuant ainsi tout obstacle pour commencer à travailler sur la consolidation de systèmes. En simplifiant la virtualisation en temps réel pour la consolidation de systèmes, congatec facilite la réduction des coûts, du nombre de systèmes et de la taille, du poids et de la consommation d’énergie (SWaP). "La consolidation sera considérablement facilitée par l’inclusion directe…
